AMD has taken center stage at Hot Chips 2025, unveiling its latest CDNA 4 architecture and the MI350 accelerator series. These groundbreaking developments promise to push the boundaries of machine learning performance. AMD’s chip architects shared in-depth technical insights, highlighting how the CDNA 4 platform powers the new MI350 family of accelerators.
Innovative 3D Die Stacking
AMD continues to innovate by building on their successful MI300 design. They utilize advanced 3D die stacking, a technology that allows for higher density and improved performance in their accelerators. This engineering feat enables increased memory bandwidth and reduced latency, making the MI350 series a powerhouse for AI and machine learning workloads.
Next-Generation Performance
The MI350 accelerators are designed for demanding machine learning tasks. Their architecture supports seamless scalability and delivers significant performance gains over previous generations. With these advancements, AMD is positioning itself as a fierce competitor in the AI hardware market.
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