Innovative Cooling for AI and Data Centers
Vertiv has launched its CoolChip CDU family, a groundbreaking solution designed for efficient thermal management in artificial intelligence (AI) and data centers. This innovative technology caters to a variety of needs, from retrofitting existing facilities to supporting the growth of high-density AI and High-Performance Computing (HPC) clusters in new builds.
The introduction of liquid-cooling technology marks a significant advancement in managing heat generated by modern data centers. As AI technologies continue to evolve, they demand greater processing power, which in turn leads to increased heat output. Vertiv’s solution effectively addresses these challenges, ensuring optimal performance and reliability.
